双面印刷电路板孔化工艺和孔化废水量核算

Double sided printed circuit board hole of electrochemistry aggradation technics and wastewater quantity compute

印刷电路板孔化工艺较为复杂,孔化质量至关重要,废水产生量较大。本文主要阐述双面印刷电路板的孔化工艺和孔化工艺废水量核算,孔化过程主要为去钻污、中和、除油、微蚀、活化、速化、化学镀铜、浸酸、镀铜、清洗,每平方米双面印刷电路板废水产生量约0.222m3/m2;为企业日常生产管理、项目环境影响评价提供参考依据。

Printed circuit board hole of electrochemistry aggradation technics is complicated, hole of electrochemistry aggradation quality is very important, a ladge quantity of wastewater was emerged. This thesis expounded double sided printed circuit board hole of electrochemistry aggradation technics and wastewater quantity compute. Cleanning, neutralisation, unoil, slimcorrosion, activation, accelerating, electroless plating copper, immerge acid, electroplate copper, cleanout are primary process, per centiare of double sided printed circuit board wastewater quantity is about 0. 222m3/m2, this paper for factory daily management of Printed circuit board production and project evaluation of environmental effect.