期刊文献+

聚合物基复合材料的界面结构与导热性能 被引量:8

Interface Structure and Thermal Conductivity of Polymer Matrix Composite
下载PDF
导出
摘要 在整理近年来国内外对聚合物基导热复合材料性能的研究工作的基础上,总结界面结构与界面处理对聚合物基复合材料界面和导热性能的影响,分析目前已有研究中的缺点和不足,提出未来改善界面结合、提高聚合物基复合材料导热性能的具体方法,并指出探究界面结构与热流散射的关系,特别是弱界面结合情况下的热流传导规律,对提高聚合物基复合材料的热导率有很大的指导意义。 The research about thermal conductivity performance of polymer-based composite material at home and abroad is sorted out, the effect of interface structure and interface treatment on polymer matrix composites'inter- face and thermal conductivity is summarized, the disadvantages of current research are indicated, the specific method to improve interface combination and thermal conductivity of polymer composites is put forward. In addition, it is also pointed out that exploring the discipline of interface structure versus heat flow scattering, expecially the heat flow con- ductive rules under the condition of weak interface bonding, has a great significance to improve thermal conductivity of polymer-based composites.
出处 《材料导报》 EI CAS CSCD 北大核心 2013年第5期76-79,86,共5页 Materials Reports
基金 国家自然科学基金(50872054)
关键词 界面结构 聚合物基复合材料 表面处理 导热性能 interface structure, polymer matrix composites, surface treatment, thermal conductivity
  • 相关文献

参考文献28

  • 1Mamunya Y P, Davydenko V V, Pissis P, et al. Electrical and thermal conductivity of polymers filled with metal pow- ders[J]. Eur Polym J, 2002,38 (9) - 1887.
  • 2Bishay I K, Abd-E1-Messieh S L, Mansour S H. Electrical, mechanical and thermal properties of polyvinyl chloride com- posites filled with aluminum powder[J]. Mater Des, 2011,32 (1):62.
  • 3Bae J W,Kim W H, Cho S H, et al. The properties of alN- filled epoxy molding compounds by the effects of filler size distribution[J]. J Mater Sci,2000,35(23) ..5907.
  • 4Yung K C, Liem H. Enhanced thermal conductivity of bo- ron nitride epoxy matrix composition through multi-modal particle size mixing[J]. J Appl Polym Sci, 2007, 106 (6): 3587.
  • 5Kinmura, Yesutaka. Phenolic resin molding materials with good thermal stability and flowability..JP, 2005281356[P]. 2005-10-13.
  • 6Mark J E. Physical properties of polymers handbook[M]. New York, USA.. Springer, 2007 : 155.
  • 7Grimvall G. Thermophysical properties of Materials[M]. Amsterdam, The Netherlands.. Elsevier Science BV, 1999.. 136.
  • 8Pietralla M. High thermal conductivity of polymers.. Possi- bility or dream? [J]. J Computer-Aided Mater Des, 1996,3 (1-3) .273.
  • 9Wong C P, Bollampally R S. Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packa- ging[J]. J Appl Polym Sci, 1999,74(14) .3396.
  • 10Sanada K, Tada Y, Shindo Y. Thermal conductivity of po-lymer composites with close-packed structure of nano and micro filler[J]. Composites Part A.. Appl Sci Manuf, 2009, 40(6-7) : 724.

二级参考文献3

  • 1Ji Y,Proceeding of the third international symposium on electronic packaging technology,1998年,158页
  • 2Majumdar A,IEEE,1996年,342页
  • 3Majumdar A,Appl Phys Lett,1993年,62卷,20期,2501页

共引文献3

同被引文献96

引证文献8

二级引证文献48

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部