HDI板爆板缺陷分析方法浅谈

Introduction of HDI PCB Delamination Defects Analysis Method

爆板是PCB制造企业中非常常见也非常严重的一种缺陷,随着后道无铅焊接制程的导入,该问题显得尤为突出,急待解决。作者根据实际工作经验,总结出了对HDI板爆板缺陷进行分析的4种不同分析方法:垂直金相切片分析法,平磨分析法,剥离分析法和Tg/T260测试分析法。通过对每种分析方法的详细介绍,总结出了其各自的优缺点和适用的场合。同时,通过对这些方法的介绍,为工程师在以后的工作中如何运用合适的方法对HDI板爆板缺陷进行全面有效的分析提供了参考。

Delamination is a normal but very critical defect/problem in PCB manufacture plant, this problem becomes more and more remarkable and needs to be solved as fast as possible with lead-free soldering applied in assembly process. Based on the author＇s working practice, this paper introduced four different analysis methods for delamination defects of HDI PCB. Vertical cross-section analysis method with microscope, Flat polishing analysis method, Peeling off analysis method and Tg/T260 test method. It is a summary of the advantage, disadvantage and application of each method. It is also a guide how to use these methods to effectively analyze HDI PCB delamination defects in future.