摘要
本文主要研讨了液相界面扩散焊工艺的几个技术关键问题,提出优化工艺参数,最终获得组织均匀、晶粒细小、无脆性、等强度的优质接头,并焊接了Ti—6Al—4V双向波纹板。
In this paper, some technical key problems of LID bonding are mainly discussed, and the optimized process variables are suggested. As a result, a brittless and equal-strength joint of high quality has been obtained with fine-grain and homogeneous microstructure. Finally, the sine-form corrugate sheets of Ti-6A1-4V have been successfully bonded.
出处
《材料工程》
EI
CAS
CSCD
北大核心
1991年第6期23-26,共4页
Journal of Materials Engineering
