摘要
随着近年来电子产品无铅化的发展,越来越多的有铅器件被无铅器件替代,其中SnAgCu合金成为BGA器件锡球的主要成分。然而在无铅焊点的可靠性未被认可之前的过渡时期,有铅焊膏和无铅器件混合焊接的情况就不可避免,尤其是在高可靠电子产品领域。因此混合焊接工艺和焊点的性能成为高可靠性电子产品组装和焊点寿命分析中的研究重点。总结了近年来对有铅焊料和无铅BGA混合焊接的一些相关研究,主要涉及混合焊接温度、混合焊点的显微组织、界面处金属间化合物、焊点力学性能、可靠性以及焊点失效机制等方面。
With the development of lead-free soldering processes in electronic assembly, more and more lead components have being replaced by lead-free components. The composition of typical solder balls of lead-free ball grid array （BGA） components is SnAoCu. Hence during the transition period, the soldering of lead-free components with SnPb paste in electronics manufacturing is inevitably because the reliability of lead-free solder joints is still unknown, especially in high reliability applications. The soldering process and solder reliability have being chief concerns in electronic assembly and life prediction of mixed solders. Introduce some studies on mixed assemblies of lead-free BGA with SnPb paste in recent years involving soldering temperature and microstructure, interfacial intermetallics and properties of mixed solders.
出处
《电子工艺技术》
2013年第2期79-85,共7页
Electronics Process Technology
基金
总装预研项目(项目编号:115318150200)
