胶体电解液点式电解蚀刻金属后粘结强度的研究

The study of bonding strength of common alloy eched by gellied electrolytic agent

目的 研究口腔内常用合金经胶体电解液点式电解蚀刻后剪切粘结强度。方法 根据各金属电解配方进行点式电解蚀刻 ,并对蚀刻前后分别与登士伯光敏固化复合树脂粘结 ,比较其剪切粘结强度。对点式电解蚀刻后和抗剪强度测试后的金属表面进行扫描电镜观察。结果 镍铬合金、钴铬合金、18- 8不锈钢、经点式电解蚀刻后均获得较高粘结强度 ,镍铬合金最高 ,同一种合金点式电解蚀刻前后的粘结强度有显著差异 (P <0 .0 1)。

Objective To study the shear bonding strength between the adhesive and alloy eched gellied electrlytic cell.Methods The effects of the surface of the alloy which was eched by gellied spot electrolytic cell were evaluated by shear stresses between adhesive and alloys and SEM observation.Results Ni-Cr,Co-Cr,18-8 stainless steel eched by spot electrolytic cell got higher bonding strength than those not etched (P< 0.01 ).The SEM observation showed that there were a lot of micro holes on the surface of alloy.Conclusion High bonding strength between alloy and adhesive can be achieved by the processing of gellied spot electrolytic etching.