摘要
以硼氢化钾(KBH4)为还原剂、硫酸铜(CuSO4.5H2O)为前驱体,乙二胺四乙酸二钠(EDTA-2Na)为络合剂,十六烷基三甲基溴化铵(CTAB)为反应场表面活性剂,KOH为pH值调节剂,制备纳米铜胶体.对影响纳米铜胶体粒径以及分散稳定性的因素进行了研究,结果表明:当CTAB,KOH,EDTA-2Na的用量分别为0.22,1.5,0.3～0.4mol/L时,纳米铜胶体的粒子粒径为30nm左右,胶体的分散稳定性较好;用该化学还原法可制备出最小粒径为1.09nm的纯净纳米铜.在聚乙烯吡咯烷酮(PVP)的保护下,可有效防止纳米铜粉末氧化.
Using KBH4 as a reducing agent, copper sulfate （CuSO4 ·5H2O） as precursors, （EDTA-2Na） as complexing agent and added CTAB as surfactant ,KOH as pH adjusting agent; And studied the influ- ence of the concentration of additives on nano-copper colloidal particle size and dispersion stability; The results showed that. when the amount of CTAB, KOH, CEDTA-2Na is 0. 22mol/L, 1. 5 mol/L,0. 3-0. 4 mol/L got the best results of nano-copper colloid particle size and dispersion stability; By chemical reduction a minimum particle size of 1.09 nm pure nano-copper was prepared. Under the protection of polyvinyl pyrrolidone（PVP） ,which can effectively prevent the oxidation of the nano-copper powder.
出处
《材料研究与应用》
CAS
2013年第1期37-41,共5页
Materials Research and Application
