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聚氨酯导线轮的制备工艺研究

Investigation on Preparation Technology of Polyurethane Wire Wheel
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摘要 用LM98–1(聚酯多元醇)、MDI(二苯基甲烷二异氰酸酯)、BDO(1,4–丁二醇)及各种助剂,通过一步法合成出了满足导线轮使用要求的热塑性聚氨酯(TPU),确定了间歇法及连续法合成TPU的工艺条件,考察了硅芯切割机用导线轮的注塑与后熟化工艺对制品的影响。 The thermoplastic polyurethane (TPU) meeting the application specifications of wire wheel was synthesized by using one-step process with LM98-1(polyester polyol), MDI(diphenylmethane diisocyanate), BDO(1,4-butanediol) and various auxiliary agents. The process conditions for synthesizing TPU by batch method and continuous method were confirmed. The influence of injection and post-slaking process of wire wheel used in the silicon chip cutting machine on the oroducts was investigated.
出处 《化学推进剂与高分子材料》 CAS 2013年第2期71-73,共3页 Chemical Propellants & Polymeric Materials
关键词 热塑性聚氨酯 切割机 导线轮 注塑 thermoplastic polyurethane cutting machine wire wheel injection
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  • 1刘红艳,万关良,闫志瑞.硅片清洗及最新发展[J].中国稀土学报,2003,21(z1):144-149. 被引量:28
  • 2郑宣,程璇.半导体硅片金属微观污染机理研究进展[J].半导体技术,2004,29(8):53-56. 被引量:7
  • 3李保军,冯涛.硅单晶锭多线切割中砂浆作用的研究[J].半导体技术,2007,32(6):512-515. 被引量:11
  • 4夏海良.半导体器件制造工艺[M].上海科学技术出版社,1985..
  • 5MOLLER H J.Basic mechanisms and models of multi-wire sawing[J].Advanced Engineering Materials,2004,6(7):501-513.
  • 6KOMATSU NTC株式会社.MWM-442DM触摸式控制板操作说明书[K].2008:7.
  • 7HAUSER C.Device for wire sawing provided with a system for directing wire permitting use of spools of wire of very great length:US,5829424[P].1998-11-03.
  • 8WANG W,LIU Z D,TIAN Z J,et al.High efficiency slicing of low resistance silicon ingot by wire electrolytic-spark hybrid machining[J].J of Materials Processing Technology,2009(209):3149-3155.
  • 9刘玉玲.超大规模集成电路衬底材料性能及加工测试技术工程[M].北京:冶金工业出版社,2002..
  • 10夏海良.半导体器件制造工艺[M].上海:上海科学技术出版社,1985..

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