金刚石/铜复合材料界面结合状态的改善方法

Improving Method of Interface Bonding State in Diamond/Cu Composite Material

电子封装用金刚石/铜复合材料中金刚石颗粒与基体纯铜的界面不润湿,界面结合状态差。通过引入碳化物形成元素Cr,Ti,B等来改善两者界面结合状态,结果表明在铜基体中加入碳化物形成元素制备的复合材料比涂覆碳化物形成元素后金刚石颗粒制备的复合材料界面结合紧密,热导率高。而另一种改善界面结合状态的方法是在此基础上增大金刚石与基体之间接触面积。对比品级差异较大的破碎料金刚石与六八面体金刚石制备的复合材料的热导率性能发现,破碎料金刚石表面积的增大有利于更充分的发挥金刚石的导热性能,且原材料成本大大降低,此类材料也将有一定的应用空间;而针对细颗粒金刚石通过表面腐蚀方法来增大表面积,预计制备的复合材料热导率也会有不同程度地提高。

In electronic packaging diamond/Cu composite material, the diamond was not wetting with liquid copper, and the interface bonding was weak. By the introduction of carbide-forming elements Cr, Ti, B and other carbides to improve the interfacial bonding be- tween the diamond particles and the copper matrix, the results showed that when adding the carbide-forming elements into the copper matrix, the interracial bonding between diamond and copper matrix was improved, and the thermal conductivity of the composite materi- al was higher than that of the composite by the coated carbide forming elements diamond particles. Another way to improve the interfa- cial bonding was based on increasing the contact area between the diamond and the matrix. Thermal conductivity of the composites pre- pared with octahedral diamond was different from that with the broken diamond. The increase of surface area of the broken material dia- mond was helpful to exert the thermal conductivity of the diamond, and the cost of raw materials was greatly reduced. Such materials would also have certain application field. The surface area of fine diamond particles after surface corrosion was increased, and the ther- mal conductivity of prepared composite was also expected to improve.