一种固态功率放大模块的热设计

Thermal design of a solid state power amplifier module

设计了一种固态功率放大模块,将功放组件和电源组件这2个主要的发热组件分别固定在2个相对的散热器上,根据发热量选择散热器筋片高度,在箱体的两端安装风机形成一个风道.在结构设计的基础上,采用理论计算进行验证,同时运用Icepak软件进行热仿真分析,并通过试验证实了该设计的可行性.

A solid state power amplifier module was designed. The two thermal components with power am- plifier module and power supply module were independently fixed two opposite cooling radiators. According to the thermal quantity, the height of cooling tooth was adjusted, and the cabinet was constructed a wind path by the fans of its both sides. On the base of the structure design, theoretical calculation was used to verify, and the software of Icepak was used to analyse the simulation thermal model, and the test result showed the feasibility.