FPC产品倒装片工艺的改善

Flip-Chip Bonding Process Improvement in FPC Product

本文主要分析了智能卡产品倒装片工艺固有的位置精度问题。通过数据分析,找出了设备长期工作后,精度下降引发产品倒装问题的主要原因。同时,采用AutoCAD软件对倒装片智能卡(Chip Card)产品的布局分析,并结合设备精度、FPC(挠性线路板)制造精度等因素,进行倒装片工艺的仿真模拟,进而可以确定需要改进的设计布局图中的关键尺寸,从而彻底地解决了引发倒装片工艺精度差的问题。

The paper mainly analyzes the root cause of inherent accuracy of flip-Chip bonding process on FPC （ Flex Print Circuit ） .The reason why the accuracy of bonding will deteriorate to induce quality issues after long time working is described by data analysis. It is an effective way to apply AutoCAD software on the Flip-Chip layout simulation combining with equipment accuracy and FPC manufacturing tolerance, to find out those key layout dimensions which need to be optimized, and then to improve the Flip-Chip bonding accuracy issues according to system tolerance analysis.