摘要
利用扫描电镜、X射线衍射仪、显微硬度测试仪,研究了固溶温度对AgCuNi合金组织、晶格常数、固溶度及显微硬度(HV)的影响。根据Vegard定律推出不同晶格常数对应的固溶度,并证明其值要大于实际固溶度。结果表明:大多数Cu-Ni第二相已在720℃溶入基体,且基体保持较多晶界,相比680℃、760℃的固溶温度,该温度下固溶后的硬度降低幅度较小;在固溶1h的前提下,固溶温度越高该合金的实际固溶度与相图中理论固溶度的偏差越大;拟合得到的固溶度与固溶温度关系式为x=-22.521 08+7.316×10-2T-4.843 9×10-5T2。
The microstructure and lattice parameter,micro hardness of Ag-Cu-Ni alloy are studied by SEM,XRD,micro hardness tester.According to the Vegard law,the theoretical solubility of different solution temperatures was proved to be less than the real one.The result shows that the second phase almost has resolved in matrix alloy when the temperature stays at 720 ℃ and the fall range of hardness is smaller than that under 680 ℃ and 760 ℃;after 1h solution process,the gap of solubility between practice and theory increased with the growth of solution temperature,and the relationship of solubility and solution temperature is x=-22.521 08+7.316×10-2T-4.843 9×10-5T2.
出处
《重庆理工大学学报（自然科学）》
CAS
2013年第3期65-69,共5页
Journal of Chongqing University of Technology：Natural Science
基金
重庆市科技攻关项目(CSTC
2011AB4051)
