添加剂对纳米晶铜膜微观结构及纳米压痕性能的影响

Influence of Additive on Micro-structure and Nano-indentation Properties of Nanocrystalline Cu Films

采用电刷镀技术制备不同晶粒尺寸的纳米晶铜膜。利用透射电子显微镜分析电刷镀纳米晶铜膜的微观结构,计算晶粒尺寸范围;利用UNMT-1型纳米力学综合测试系统对电刷镀纳米晶铜膜进行室温纳米压痕实验。由实验可知,添加剂对纳米晶铜膜的晶粒尺寸和压痕硬度均有较大的影响。在添加剂45g/L条件下,平均晶粒尺寸最小为32nm左右,压痕硬度为3.26GPa;在添加剂1g/L条件下,平均晶粒尺寸增大到150nm左右,压痕硬度减小为1.72GPa。

The nanocrystalline Cu films of different grain sizes were prepared by brush plating, Transmlsslon electron microscopy （TEM） was used to analyze the micro-structure of the nanocrystalline Cu films and calculate their grain size range. Room-temperature nano indentation experiment was performed on the nanocrystalline Cu films by universal nano/micro material tester UNMT 1. The results show that additive has a great influence on the grain size and indentation hardness of the nanocrystalline Cu films. When the content of the additive is 45 g/L, the minimum average grain size of the films is about 32 nm and the indentation hardness 3.26 GPa, but when the content of lhe additive is 1 g/L, the grain size increases to around 150 nm and the indentation hardness decreases to 1.72 GPa.