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沉积电流对Co-Pt-P薄膜耐蚀性的影响

Effects of Deposition Current on Corrosion Resistance of Co-Pt-P Film
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摘要 采用电沉积技术制备了Co-Pt-P磁性薄膜,着重研究了沉积电流对镀层表面形貌及耐蚀性的影响。实验结果表明:当沉积电流为0.08A时,镀层晶粒连续、致密,自腐蚀电流密度最小,耐蚀性较好;当沉积电流小于0.08A时,镀层晶粒小且不均匀;当沉积电流大于0.08A时,镀层表面应力较大,呈现较多的裂纹。 The Co-Pt-P magnetic film was prepared by electrodeposition. The effects of deposition current on the coating surface morphology and corrosion resistance were emphatically studied. The experimental results show that when deposition current is 0. 08 A, the Co-Pt-P film has continuous and dense grains, minimum self corrosion current density and better corrosion resistance; when deposition current is lower than 0.08 A, the grains of the coating are smaller and nonuniform; and when deposition current is higher than 0.08 A, the surface of the coating has a larger stress, exhibiting more cracks.
出处 《电镀与环保》 CAS CSCD 北大核心 2013年第2期16-18,共3页 Electroplating & Pollution Control
基金 浙江省教育厅科研项目(No.Y201122332) 浙江省自然科学基金项目(No.LQ12E01005)
关键词 Co—Pt—P 磁性薄膜 沉积电流 耐蚀性 Co-Pt-P magnetic film deposition current corrosion resistance
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