摘要
对塑料薄膜进行低温等离子体表面处理,磁控溅射Ni-Cr过渡层、Cu植晶层后再电镀,所得镀层致密且结合力好。讨论了等离子体处理时间、磁控溅射过渡层和植晶层对后续镀层结合力的影响。指出了镀镍的工艺条件控制对镀层应力的影响。采用该工艺制备的屏蔽材料质量轻、价格低、有较好的机械性能,在电磁屏蔽领域应用广泛。
The surface of the plastic film was treated by low temperature plasma, prepared with nickel-chrome transition layer and copper plant crystal layer by magnetron sputtering, and then electroplated, obtaining a compact coating with good binding force. The effects of plasma processing time, magnetron sputtering transition layer and plant crystal layer on the binding force of subsequent coating are discussed. The impact of nickel plating process condition control on the binding force of the coating is pointed out. The shielding materials prepared with this technology are light in weight and low in price; possess better mechanical properties, so have wide applications in electromagnetic interference shielding field.
出处
《电镀与环保》
CAS
CSCD
北大核心
2013年第2期34-36,共3页
Electroplating & Pollution Control
关键词
塑料薄膜
低温等离子体
磁控溅射
电镀
屏蔽
结合力
plastic film
low temperature plasma
magnetron sputtering
electroplating
shielding
binding force