摘要
随着片上系统(SoC)设计复杂度的增加,芯片设计和验证之间的差距逐渐拉大。如何提高验证效率成了集成电路业面临的一个巨大挑战。该文回顾了近年来面向这一挑战的国内外研究工作,提出了一个新的验证范例——边设计边验证。该方法结合结构化设计和递归式验证,用于缓解验证的负担。同时,还提出了实现该方法的基本要素,用于指导未来的研究。
As system on chip (SoC) design complexity explodes, the gap between chip design and verification has been widened. How to improve verification productivity represents a great challenge to the IC industry. Recent efforts in addressing this challenge are reviewed and then a new verification paradigm, verification-while-designing, is proposed. This methodology combines hierarchical design and recursive verification, aiming at releasing the verification challenge. The fundamental points enabling the methodology are also outlined.
出处
《电子科技大学学报》
EI
CAS
CSCD
北大核心
2013年第2期162-170,共9页
Journal of University of Electronic Science and Technology of China
基金
Supported by the National Natural Science Foundation of China under Grant(61204022)
he Natural Science Foundation of Tianjin China under Grant(12JCYBJC30700)~~
关键词
形式验证
递归式验证
仿真
SoC硬件验证
formal verification
incremental verification
simulation
SoC hardware verification