摘要
随着塑封器件在武器系统中的使用越来越广泛,塑封器件在使用中也暴露出了一些问题,如塑封器件易打磨、翻新,内部易进入水汽产生爆米花效应或内部界面分层等。作者总结近几年塑封器件DPA试验中出现的各种失效,重点对塑封器件内部界面分层以及分层产生的原因、危害进行了论述。同时,论述了声学扫描显微镜检查对内部界面分层的辨别、原理及其相关试验标准等,提出了塑封器件在型号产品中的使用建议。
With the widespread use of the Plastic Encapsulated Microcircuit (PEM) in weapon system, the PEM in use also exposed some problems, For example the PEM is easy to burnish or Face-lift, and the inside is easy to enter the water vapor produce popcorn effect or internal interface delaminate, etc. The author collected the DPA tests of PEM appeared in all kinds of failure in recent years, focus discussion on internal interface delamination, the reason of internal interface delamination and the harm. At the same time, discussing the SAM to internal interface delaminated discrimination, principle, related standard etc, put forward the PEM in the use of type of product advice.
出处
《电子与封装》
2013年第3期9-12,共4页
Electronics & Packaging
关键词
塑封器件
DPA
超声扫描
plastic encapsulated microcircuit (PEM) acoustic microscope (SAM)
destructive physical analysis (DPA)
scanning