摘要
采用还原气氛焊接,研究了LTCC基板的表面金属化工艺对In-Sn、Pb-Sn和Au-Sn焊料可焊性的影响。结果表明厚膜烧结的PdAg导体可焊性较差,In-Sn和Pb-Sn焊料在其表面分别出现了不润湿和溶蚀现象。通过对LTCC基板表面导体进行电镀改性,Cu/Ni/Au镀层提高了Pb-Sn和Au-Sn焊料的可焊性,而Cu/Ni/Sn镀层则提高了In-Sn和Pb-Sn焊料的可焊性。最后,对提高可焊性的因素进行了讨论。
The effects of surface Metalizing Techniques on solderabilities of solder, such as In-Sn, Pb-Sn and Au-Sn, were investigated using reducing atmosphere soldering. The results shown that the solderabilities were very poor on the PdAg conductor sintered through thick film technology, The nonwetting and dissolution was arisen in In-Sn and Pb-Sn solder respectively. The solderability of Pb-Sn and Au-Sn solder were improved by electroplating Cu/Ni/Au trilay surface finish of LTCC substrate. While that of In-Sn and Pb-Sn were improved by Cu/Ni/Sn trilay surface finish. Finally, the factors for improving solderability were discussed.
出处
《电子与封装》
2013年第3期13-15,23,共4页
Electronics & Packaging
关键词
还原气氛
金属化
可焊性
溶蚀
润湿性
reducing atmosphere
metallization
solderability
dissolution
wetting
