基底材质对冲液电铸层结构及内应力的影响

Influence of Basal Material on the Structure and Internal Stress of Deposit Prepared by Flushing Electroforming

采用冲液电沉积工艺,分别于紫铜和不锈钢两种不同材质基底制备金铸层,并研究基底材质对电铸层结构、内应力及结合强度的影响。结果表明:紫铜基底电铸层结构紧致、内应力低、结合强度高,而不锈钢基底电铸层恰巧相反。

Gold electrodeposit was prepared by flushing electrodeposition process based on red copper and stainless steel basement respectively, and its microstructure, internal stress as well as bonding strength was investigated and analyzed. The results show that the electrodeposit featuring compact structure, low internal stress and high bonding strength can be obtained using red copper basement.