摘要
SiCp/Al复合材料具有可调的热膨胀系数(CTE)、高热导率、低密度和良好的尺寸稳定性等优异性能,广泛应用于航空航天、军用电子等封装领域,由于SiCp/Al复合材料制成的组件工作环境较为苛刻,温度变化对其影响值得探讨。文章研究了热循环对SiCp/Al复合材料的CTE、热导率和弯曲强度的影响,并对其热膨胀行为作了分析。实验结果表明,热循环能有效降低SiCp/Al中的热残余应力,其热性能比铸态明显改善,弯曲强度有所降低;在低温阶段,经退火处理和退火处理+热循环处理后SiCp/Al的CTE基本重合,在高温阶段,经退火处理+热循环处理后的SiCp/Al具有更低的CTE。
SiCp/Al composites has a variety of outstanding properties such as low coefficient of thermal expansion, high thermal conductivity, low density and good dimensional stability, widely used in the field of aerospace and military electronics package. The impact of temperature fluctuations on SiCp/Al composites will be worth exploring. In this paper, the effects of thermal cycling on the properties of SiCp/Al composites were investigated and the behavior of thermal expansion was analyzed. The results show that the thermal residual stress of composites was reduced by thermal cycling and the thermal properties of composites were improved, while the flexuml strength decreased. In the low temperature stage, CTE curve with temperature of SiCp/Al was coincident after annealing and annealing ＋ thermal cycling treatments, while in the high temperature stage SiCp/Al had a lower CTE.
出处
《电子与封装》
2012年第11期13-16,48,共5页
Electronics & Packaging
关键词
SICP
AL复合材料
热循环
热残余应力
CTE
热导率
弯曲强度
SiCp/Al composites
thermal cycling
thermal residual stress
coefficient of themal expansion
thermal conductivity
flextural strength
