Ti对Ag—Cu系活性钎料微观组织及性能的影响

The influence of Ti on microstructure and properties of Ag-Cu system active filler metal

研究了Ti对Ag—Cu系活性钎料的润湿性、力学性能及微观组织的影响。结果表明,随着含Ti量(6～12wt%)增加,Ag—Cu—Ti系活性钎料对被焊基体c—BN的润湿性提高,而钎料显微硬度升高脆性增加,钎焊接头强度降低。Ag—Cu—Ti系活性钎料是由α—Ag固溶体、α′—Cu固溶体、Ag—Cu共晶和Ag-Ti、CuTi3等化合物组成。随含Ti量增加,α—Ag固溶体、脆性化合物增加,共晶组织减少,由于脆性化合物增加,钎料铸态组织中有微裂纹形成。当含Ti量为10wt%时,钎焊c—BN接头界面结合致密,形成化合物型界面,实现Ag—Cu—Ti系活性钎料与c—BN的界面冶金结合。

The wettability,mechanical properties and microstructure of Ag-Cu system active filler metal are studied in this paper.The results show that the wettability of Ag-Cu-Ti system filler metal to the connected c-BN is improved with the increasing of Ti（6~12wt%）,while the solidity and brittle of microstructures are increased,the strength of connecting head is reduced.The Ag-Cu-Ti system filler metal is composed of α-Ag andα′-Cu solid solutions,Ag-Cu eutectic,AgTi,CuTi3 and other compounds.With the increasing quantity of Ti,α-Ag solid solutions and brittle compounds will increase,and the eutectic structure will decreased.The increase of brittle compounds cause the formation of microcrack in filler metal as-cast.When Ti content is 10wt%,joint interface between filler metal and c-BN will compact to form the compound type interface.The chemical metallurgic bonding has been realized in the interface between Ag-Cu-Ti system active filler metal and c-BN.