摘要
针对客户提出利用激光加工设备在无街区的PZT陶瓷表面进行直线切割的工艺要求,改变激光加工设备以往只针对晶片表面街区切割的单一加工模式,设计并实现新的激光加工工艺时序,拓展了激光加工设备的应用领域。
Be aim to the new requirement of the without any block on the surface of sapphire wafer, the new scheduling. This function has changed application of laser machining equipment. consumers about Laser Machining PZT ceramic this article discuss and achieve the function about the single machining mode and expanded the
出处
《电子工业专用设备》
2013年第4期24-28,共5页
Equipment for Electronic Products Manufacturing
