阻抗一致性研究

Study on impedance consistency

随着电子行业飞速发展,对信号传递的频率和速度要求越来越高;PCB板在制作上也相应的出现高频高速阻抗的设计要求。因此对PCB板上的阻抗控制要求越来越高,使之满足高频、高速的需求,阻抗控制在PCB制作中愈显重要;主要通过对阻抗附连板条的信号线长度、型号形态、参考层反焊盘设计、信号线到铜皮的距离、NPTH(非镀通孔)到信号线的距离,信号线过孔孔径大小、信号线过孔内层焊盘大小等设计因子的研究;找出影响阻抗的因子,规范阻抗附连板的设计,以提高附连板与成型区的阻抗一致性。

With the rapid development of Electronics Industry, it requires higher frequency and speed of signal transmission. Thus, it will have design request of high frequency and high speed impedance in PCB fabrication. In order to meet the requirement of high frequency and high speed, Impedance control during PCB manufacturing is more and more important. This thesis will perform a series of research on design factor, such as signal line length of impedance coupon, type, Referenced layer anti-PAD design, Distance between signal line and copper area, Distance between NPTH hole and signal line, Hole size of holes between signal lines, Inner layer PAD size of PAD between signal lines, to find the factors which affect impedance and standardize the design of impedance coupon. So that can assure the impedance consistency of coupon and pattern.