新一代高多层印制线路板用高耐热、低CTE覆铜箔层压板材料

New Generation of high heat resistance and low CTE copper clad laminates for high layer count printed circuit boards

随着电子产品无铅化、无卤化的发展,印制电路板(PCB)对覆铜板的要求越来越高,主要表现在耐热性和可靠性,特别是高多层PCB密集BGA的爆板分层现象越来越频繁。文章研究了一种高耐热、低CTE的覆铜箔层压板以及粘结片材料,针对该材料进行高多层PCB耐热性和通孔可靠性应用研究,包括24层厚4.0mm通讯背板和20L通讯背板的IST测试0.8mm间距密集BGA处在经受6次无铅回流焊后无分层爆板等失效情况出现,表现出优良的高多层适应性。该材料的主要特点为Tg(DMA)>180℃,Td(5%Loss)>350℃,Z轴热膨胀系数α1<45μm/(m.℃),α2<220μm/(m.℃)。

With the development of lead free and halogen tree electromcs prooucts, prlntea circuit ooam （PCB） has higher and higher requirements on copper clad laminate, mainly in heat resistance and through hole reliability, especially for high layer count PCB, higher risk of failure in high density BGA is commonly found. This article introduces a novel high thermal reliability and low Z-CTE copper clad laminate material, which is suitable for high layer count PWBs application, having superior performance in high layer count PCB as evaluated here, which can pass the 24 layer 4.0mm thick 0.8mm pitch BGA 5X lead free reflow test.The major features of this material are Tg（DMA）〉180℃, Td（5% Loss）〉350℃, Z-CTE 1〈45 μm/（m·℃）, 2〈220 μm/（m ·℃）.