摘要
文章从蚀刻因子,铜厚以及线间距入手,研究了线宽补偿和这三个因素的关系,并使用公式表述,从而可指导酸性蚀刻减成法线宽补偿的工程设计,并为后续研究103μm(3oz/ft2)以上厚铜板的补偿提供了方向。
This paper has done a research on line width compensation of subtractive process in PCB industry. Pointing out the relationships between compensation and E-factor, copper thickness and line space, it uses 3 formulas to express them. The results do not only supply us guidance for compensation design before manufacturing, but also show us a research direction about thick copper board＇s compensation.
出处
《印制电路信息》
2013年第4期88-99,共12页
Printed Circuit Information
关键词
蚀刻因子
补偿量
铜厚
线间距
动态补偿
E-factor
Compensation
Copper Thickness
Space
Dynamic Compensation
