二氧化碳激光钻孔机新技术应用的探究

Research on the new technology application with CO_2 laser-drilling

目前,在印制电路行业中,二氧化碳激光钻孔主要应用于微小孔径的钻孔。文章根据我公司实际生产需要,结合紫外激光器的应用技术,探索开拓二氧化碳激光钻孔在印制电路板制造工艺中的应用领域,并研究开发出二氧化碳激光钻孔应用于挠性电路板辅料外型切割加工、刚挠结合板硬板揭盖及聚四氟乙烯材料表面粗化三方面,以期让业界对二氧化碳激光钻孔应用技术能有新的思考。

At present, in PCB industry, CO2 laser drilling is mainly used in drilling process for micro-via. In this paper, according to the actual production needs of our company, combined with UV laser applied technology, we explored the new application fields of CO2 laser-drilling in PCB manufacturing process, researched and developed three kinds of technology, which is CO2 laser-drilling used in the outline cutting processing for flexible circuit accessory materials, uncovering the surplus rigid parts for Rigid-Flexible PCB and roughening the surface of PTFE material, in order to make the PCB industry rethink the applied technology of CO2 laser-drilling.