关于改善小孔背钻堵孔的研究

Study on solving hole block of back drill

当前限制背钻产品发展的两个问题:(1)高厚径比板小孔/深孔背钻堵孔问题;(2)背钻设计对图形电镀-碱蚀工艺的依赖性,此问题同样源于背钻堵孔问题。文章从背钻堵孔产生的机理入手,系统的进行分析,并提出针对性改善方法,最终总结出一套完备的解决方案。

There are two obstacles against the development of back drill products： 1. Hole block problem of high thickness-diameter ratio/high depth back drill. 2. Limit of back drill design on PTP-SES, which roots from hole block as the same. This issue makes systems analysis on the origins of back drill hole block, proposes methods, and at last sums up a mature plan.