封闭“无铜区”多层压合方法的研究

Multilayer pressing study with superposition and closed “copper free area” inner graphics

文章以一典型内层图形含有叠加、封闭"无铜区"的多层PCB产品的压合实验为主线,较详细的介绍了压合方法、压合程式、叠片方式、拼版方式等对此特殊结构压合质量的影响,并最终通过实际实验结果分析得出较适用于此类封闭"无铜区"结构的压合方法,为改善"无铜区"压合褶皱、白斑等问题提供指导。

This article is based upon a typical muhilayer press experiment of several PCB production, which has superposition and closed ＂copper free area＂ inner graphics. It particularly introduced the influence of different lamination equipment, lamination process, different lamination structure and manufacture array for this special structure. And finally based on the analysis of actual experiment, it raised some proposal which is more suitable for the lamination of the special structure, provided good guidance as pressing drape, crazing and etc. which has significance to improve the problem such