电化学方法分析电镀铜添加剂的副产物

Electrochemical methods applied in the analysis on the By-products of copper plating additives

文章介绍了一种表征电镀铜添加剂的副产物的方法。具体方法是恒流法,在一恒定的电流密度下,利用阴极电位变化值Δφ的大小来进行添加剂的副产物的表征。首先,采用此方法分析电镀液各组分不同浓度对Δφ的影响,发现各组分浓度在控制范围内变化时,Δφ小于某一定值;然后,通过空气氧化、H2O2氧化、电解的方法产生副产物,Δφ值有明显的增大;最后,通过不同的处理方式后,Δφ值有明显的降低,大部分的副产物被除去。

In the thesis, we introduce a method which can characterize the by-products of additives in the copper plating process. The specific method is constant current method. With a constant ampere density, we characterize the by-products of additives by calculating the cathode potential change of △Ф. First of all, using this method analysis of the influence to △Ф of different concentration of each components in the plating solution, we find the component concentration change in the range of control, △Ф less than a constant value. Then, through the electrolytic, air and H202 oxidation methods produce by-products, the value of △Ф signally increase. Finally, after the different treatment methods, the value of △Ф has signally reduced, and by-products have almost removed.