向数字化发展的红外焦平面列阵

Toward Digitization in Infrared Focal Plane Array

在过去数年里,红外焦平面列阵(FPA)取得了显著进步,近来的研发重点已经集中到硅读出集成电路(ROIC)上,帧频增加、引入新型的信号处理功能是该领域的重要进展。因为优于具有模拟信号输出的探测器,具有数字信号输出的FPA备受关注。数模转换器(ADC)在芯片上的实现是数字FPA的基础,片上ADC有三种结构,即芯片级ADC、列级ADC和像元级ADC。主要通过对部分有关英语文献资料的归纳分析,介绍了数字化FPA的发展动向和趋势。

Over the past several years, significant advances in infrared focal plane array（FPA）development have been achieved. Latest developments have been focused on the silicon readout integrated circuit （ROIC） . Increasing of frame rate, new types of signal processing functions are an important progress in this field. A FPA with a digital signal output has attracted a lot of attention due to its advantages over detectors with analog signal outputs. The realization of analog to digital converter （ADC） on chip is the base of digital FPA. There are three on-chip ADC architectures, i.e., chip-level ADC, column-level ADC and pixel-level ADC. Mainly by summarizing and analyzing of some related references published in English, the status and trends of digital FPA were presented in this paper.