摘要
采用玻璃喷砂打孔、阳极键合、玻璃通孔镀膜工艺，成功制备出基于TGV的玻璃封帽结构，并应用于微机电（MEMS）器件加工中。
Relative to TSV （Through Silicon Via） process, study of TGV （Through Glass Via）Process is less. It has not been reported in the country. In the paper, glass sandblasting process, anodic bonding process, glass via sputtering process are used for TGV glass cap structures, and are applied for MEMS devices fabrication.
