塑封BGA器件分层机理分析

Analysis of invalidation of PBGA Devices

塑料封装集成电路暴露在一定潮湿的环境下将会吸潮的现象已经得到业界广泛的认同和关注。潮湿环境对电子元器件的危害,会随着潮湿敏感性元件使用的增加而越来越不容忽视,特别是对于薄的密间距元件和塑料封装BGA器件,这个问题尤为严重。本文根据某项目中塑料封装BGA器件分层案例,通过实验手段对塑封BGA器件进行检验和分析,结合IPC相关标准,研究分析了塑封BGA器件的分层机理及产生原因,研究得出BGA器件的失效原因。并在此基础上,提出了有效控制器件因潮湿引起的分层失效的措施建议。

Plastic-encapsulated IC is known to absorb moisture when exposed to humid ambient condition. Along with increase--using of moisture sensitivity devices, such as thin PQFP devices and PBGA devices, the moisture becomes extremely harmful to electronic devices. Integrating with the co-- relational standards of IPC, the author inspects and analyses the BGA devices invalidating because of delaminating with experimentation, analyses the cause of delaminating in PBGA device and researches the mechanism of delaminating. Finally, the cause of invalidation in PBGA devices is oriented nicely. At the same time, the author gives some suggestion that could decrease the risk of invalidation in BGA devices caused by absorbing moisture.