摘要
随着SMT朝着细间距元件的方向发展,用于返修SMT元件的方法很多,本文着重介绍使用传导和对流方法返修元件的实例,以及这两种方法对元件进行返修过程中存在的利弊。
With the SMT moving in the direction of fine-pitch components development for a lot of rework SMT components, this article focuses instance conduction and convection rework components, and these two methods of element rework process, the pros and cons.
出处
《电子世界》
2013年第8期69-69,共1页
Electronics World
关键词
SMT
传导方法
对流方法
SMT
conduction method
convection method
