电子封装用氰酸酯复合材料的研究

Novel Cyanate Ester Resin Composites for Microelectrical Packaging

采用氮化铝(AlN)和纳米氮化铝(n-AlN)、二氧化硅(SiO2)以及经过硅烷偶联剂(KH560)处理的AlN和SiO2与氰酸酯(CE)树脂共混,设计制备了AlN/CE,n-AlN/CE,AlN-SiO2/CE和AlN(KH560)-SiO2(KH560)/CE复合材料。研究了填料的种类、粒径、含量和表面性质对复合材料导热性能、介电性能的影响。结果表明:填料对复合材料的导热性能有显著影响,用n-AlN和AlN混合填充CE,不同粒径的AlN可以形成紧密堆砌而提高热导率λ。高含量的AlN添加到CE中会提高复合材料的介电常数,但将SiO2部分取代AlN,能减少介电常数的增加量。

Three composites based on CE resin, aluminum nitride （AIN）, nano A1N （n-A1N） and sili- con dioxide （SiO2）, and silane coupling agent （KH560） modified A1N and SiO2 ,coded as A1N/CE, n-A1N/CE, A1N-SiO2/CE and A1N（KH560）-SiO2 （KH560）/CE composite, respectively, were pre- pared. The influences of the sort, size and surface nature of fillers on the thermal conductivity and die- lectric properties of composites were investigated in detail. The results show that properties of fillers have great influence on the thermal conductivity of composites. When CE resin was filled by n-A1N and A1N,the resultant composites increased thermal conductivity due to the close arrangement. The composite with a higher content of A1N had higher dielectric constant. But when SiO2 was used to re- place A1N,the increasement of dielectric constant was reduced.