用于SPICE模拟高频互连效应的RLC电路模型

An Equivalent RLC Circuit Model for SP ICE Simulation of Interconnect Effects in High Frequency

提出了一个用于 SPICE模拟高频互连效应的 RLC互连电路模型 ,该模型考虑了频率对互连电感、电阻的影响 ,适用于从芯片间互连到芯片内互连高频效应的分析。基于所提出的互连模型 ,对频率达 1 0 0 0 MHz时芯片内长互连线的延迟、串扰、过冲等互连寄生效应进行了分析 。

WT5”BZ ]An equivalent RLC circuit model for analyzing propagation characteri stics of high frequency waves on interconnects is presented The model, in whi ch the effects of frequency on interconnect inductance and resistance have been considered, is available for analyzing both package level interconnect and on chip interconnect in the whole spectrum, by using the nodal electrical simulator SPICE Based on the model, the on chip interconnect effects,such as delay, crosstalk and overshoot,have been analyzed for an input pulse frequenc y of 1000 MHz, and techniques to suppress those interconnect effects have be en proposed