埋置电阻及其工艺的研究

Study on buried resistors and its fabrication process.

在陶瓷多芯片组件中 ,应用埋置厚膜电阻可以提高组装密度 ,降低成本。研制了一种用于 L TCC基板的埋置用厚膜电阻浆料 ,分析了三种主要工艺对埋置电阻性能的影响。结果表明 ,热压力对电阻的阻值有一定影响。增加热压力 ,可使电阻的阻值增大 ;调阻槽对埋置电阻的阻值影响不大 ;厚膜电阻的埋置深度不会明显改变电阻的阻值、 α及稳定性。

In C hinese. By using buried resistors in MUM-C, the mount density can increased a nd cost red uced. The thick film resistor paste used for buried resistors in LTCC is develo p ed. The effects of lamination pressure, trim-hole and buried depth on the perf or mances of buried resistors is analyzed. The results show that sheet resistance i ncreases with lamination pressure; resistance-trim-slot does not make a great ch ange in sheet resistance; depth of buried resistors do not make a great change i n sheet resistance, temperature coefficient and stability. (6 refs.)