摘要
采用光学金相、扫描电镜、电子探针成分分析和显微硬度测定等方法分析了双卡簧片非正常断裂的原因。在部分双卡簧片折弯处发现有尖锐凹角并有明显微裂纹 ,裂纹表面有镍和铜 ,说明裂纹是在成形加工过程中形成。
Failure causes of double clip reed were analyzed by means of optical microscopy, scanning electron microscopy, electron probe microanalysis and micro hardness tester. Nickel and copper elemens on crack surface showed crack formation during forming process. It was concluded that failure of double clip reed was the result of local stress concentration and cracking at the sharp elbow of reed.
出处
《理化检验（物理分册）》
CAS
2000年第2期83-85,共3页
Physical Testing and Chemical Analysis(Part A:Physical Testing)
关键词
金相
扫描电镜
失效分析
双长簧片
Reed Metallography Scanning electron microscopy Failure analysis
