摘要
综述了陶瓷粉体化学镀前常用的活化处理方法的研究现状、处理过程和应用,包括敏化-活化两步法,胶体钯活化法,敏化-活化一步法,离子钯敏化-活化处理及不含贵金属的活化法。展望了陶瓷粉体化学镀前活化处理技术的发展前景。
The present research situation, processing practice and application of commonly used activation technologies for ceramic powder before electroless plating were summarized, including two-step sensitization- activation process, colloidal palladium activation process, one-step sensitization-activation process, ionic palladium sensitization process and activation process without noble metal. The development of the above activation technologies was forecast as well.
出处
《热处理》
CAS
2013年第2期20-23,共4页
Heat Treatment
基金
合肥工业大学大学生创新项目(cxsy102087)
浙江省科技厅一般工业项目(2009C31129)
关键词
陶瓷粉体
化学镀
活化处理
ceramic powders
electroless plating
activation treatment
