热透波机理及热透波材料进展与展望

Major Advancement and Development Trends in Studyof Hot-Wall Microwave-Transparency Mechanisms and High-Temperature Microwave-Transparent Materials

简要阐述了热透波问题的产生背景及其科学技术内涵,从烧蚀传热行为规律、热电行为规律与热透波机理、高温介电性能测试、热透波模拟试验和热透波材料5个方面对国内外研究进展进行了系统总结,在此基础上展望了热透波材料的发展方向。研究结果表明:附有熔体的高温壁面和动态变化的固液气三相状态导致天线窗/罩电性能发生突变,是高超声速航天器产生"黑障"的主要原因。氧化硅、氮化硼和硅-氧-氮材料分别属熔融型、气化型和熔融/汽化混合型烧蚀热透波材料。气化型氮化硼的微波传输效率受电子电导损耗控制,熔融型氧化硅的微波传输效率则受离子电导损耗控制。大尺度、高精度和宽温宽频是热透波材料性能评测和分析模拟技术的重要发展方向,向大尺寸"Si(B)-O-N-(M)"三元体系跨越是热透波材料制备技术创新发展的主要趋势。

The background and physics-basis of hot-wall microwave-transparency problem are discussed in this paper. Major advancement is summarized in areas including behavior of ablation and heat-transfer, thermo-dielectric behavior and hot-wall microwave-transparency mechanism, high-temperature dielectric testing, simulation of hot-wall microwave-trans- parency, and high-temperature microwave-transparent materials. Future development trends in related areas are presented. High-temperature melt and dynamic diversification of solid/liquid/gas result in break of dielectric property for hot-radome or antenna window, which is the main reason for the ＂blackout＂ of hypersonic aerospace vehicles. Silica, boron nitride and Si-O-N material are melting ablation, evaporation ablation and melting/evaporation ablation materials respectively. The microwave transporting efficiency of boron nitride is directed by electron conducting loss, while the microwave trans- porting efficiency of silica is directed by ion conducting loss. Large-scale, high precision, wide temperature range and wide frequency range are the main objective for next generation test and computation technology for hot-wall transparent materials. Big size and Si（B）-O-N-（M） based materials are the important trend for developing new hot-wall transparent materials.