摘要
Effects of NH3 rapid thermal annealing （RTA） on the interface and electrical properties of Gd-doped HfO2 （GDH）/Si stack were investigated. The process of NH3 annealing could significantly affect the crystallization, stoichiometric properties of GDH film and the interface characteristic of GDH/Si system. NH3 annealing also led to the decrease of interface layer thickness. The leakage current density of Pt/GDH/p-Si MOS capacitor without RTA was 2× 10-3 A/cm2. After NH3 annealing, the leakage current density was about one order of magnitude lower （3.9× 104 A/cm2）. The effective permittivity extracted from the C-V curves was -14.1 and 13.1 for samples without and with RTA, respectively.
Effects of NH3 rapid thermal annealing （RTA） on the interface and electrical properties of Gd-doped HfO2 （GDH）/Si stack were investigated. The process of NH3 annealing could significantly affect the crystallization, stoichiometric properties of GDH film and the interface characteristic of GDH/Si system. NH3 annealing also led to the decrease of interface layer thickness. The leakage current density of Pt/GDH/p-Si MOS capacitor without RTA was 2× 10-3 A/cm2. After NH3 annealing, the leakage current density was about one order of magnitude lower （3.9× 104 A/cm2）. The effective permittivity extracted from the C-V curves was -14.1 and 13.1 for samples without and with RTA, respectively.
基金
supported by National Natural Science Foundation of China (50932001)
National Natural Science Foundation of China (51102020,51202013)
National Science and Technology Major Project(2009ZX02039-005)
