基于复合相变材料的电子芯片热管理性能研究

Research on the Thermal Management Performance of Electronic Chip with Composite Phase Change Material

为了提高小功率电子器件的热管理能力,今以PEG1000为相变材料,膨胀石墨(EG)为载体基质,采用物理吸附法制备出导热系数高、热响应速度快的PEG1000/EG复合相变材料,并选择PEG1000质量含量90%的复合相变材料应用于电子温控散热系统。通过分析不同输出功率条件下模拟芯片表面及相变材料内部的温度随时间的变化规律,考查复合后的相变材料的温控能力。研究表明,散热器填充复合相变材料后的散热性能明显优于填充前的,模拟芯片表面的升温速率明显降低。此种复合相变材料的使用能有效提高电子器件的热管理能力。

In order to improve the thermal management ability of electronics or chips, a composite phase change material PEG1000/EG with high thermal conductivity and rapid thermal responsiveness was prepared by physical absorption method in which PEG1000 was used as phase change material （PCM） and expanded graphite（EG） as supporting material. The composite phase change material containing 90% mass fraction of PEG1000 was applied to the PCM-based simulate-chip thermal management system. The thermal controlling ability of PEG 1000/EG composite was investigated by analyzing the variations of temperature on the surface of the simulate chip and inside the PCM during a working cycle under different output powers. It was found that the heat sink filled with composite PCM performs much better on heat dissipation, and the heating-up rate of the simulate chip declines significantly compared with that of chip without covered with PCM. It is implied that PEG1000/EG composite phase change material has an enormous potential in improving the thermal management ability of electronic devices.