Actiflo~工艺技术应用于硅片研磨废水处理

Application of Actiflo~ Technological Processes in Silicon Wafer Grinding Wastewater Treatment

考虑到硅片研磨废水浊度高、悬浮固体粒径小及难于沉淀的水质特点,并依据处理水量的增加和后期回用的要求,采用Actiflo微砂压载絮凝工艺对现有的混凝沉淀处理装置进行升级改造。改造后处理能力由原来不到20 m3/h提高到40 m3/h,表明Actiflo微砂压载絮凝工艺对难处理的高浊度硅片研磨废水具有稳定且良好的处理效果。进水浊度平均值为2 120 NTU,装置处理后出水浊度小于10 NTU,浊度去除率高达99%以上。

Considering the silicon wafer grinding wastewater with high turbidity, small suspended solids, difficultly precipitating, the expansion for treatment capacity and future reuse requirement, the advanced Actiflo micro-sand ballast flocculation process was applied to upgrade the existing grinding wastewater treatment unit which used conventional coagulation and sedimentation processes. After the upgrading, the treatment capacity was increased from 20 to 40 m3/h. The results show that Actiflo micro-sand ballast floc- culation process has a good and stable effect on treating silicon wafer grinding wastewater with high turbidity. The turbidity of effluent is less than 10 NTU when average turbidity of influent is up to 2 120 NTU. The removal rate of turbidity is more than 99 %.