摘要
对绝缘体上硅工艺来说,静电保护可靠性是一个关键且具有挑战性的问题。着重于研究H型栅SOIMOS的维持电压,通过实验发现此器件的维持电压与栅宽紧密联系。结合TCAD仿真解释了器件的工作机理,通过建立集约模型并由HSPICE仿真,揭示了体电阻与维持电压之间的关系。
Electrostatic discharge reliability is a vital and challenging issue for SOI (Silicon on insulator) technology. The paper focused on holding voltage on which latch up risk depends di- rectly for H-gate SOI MOS. A new phenomenon was indicated that among investigated device pa- rameters the gate width affected holding voltage strongly also. Then the device operating mecha- nism was discussed through TCAD simulations. Combining with a compact model and HSPICE simulations the relationship between bulk resistor and holding voltage was revealed finally.
出处
《固体电子学研究与进展》
CAS
CSCD
北大核心
2013年第2期108-111,共4页
Research & Progress of SSE
基金
国家自然科学基金资助项目(60927006)
关键词
绝缘体上硅
静电保护
维持电压
SOI (silicon on insulator)
ESD (electrostatic discharge) protection
holding voltage