脉冲偏压对(Ti，Al)N涂层应力分布及其力学性能的影响

Effects of Pulse Bias Voltage on Stress Distribution and Mechanical Properties in(Ti,Al)N Coatings

利用电弧离子镀技术在不锈钢基体上制备了(Ti,Al)N涂层,研究了脉冲偏压对涂层残余应力沿层深分布及相关力学性能的影响。结果表明,(Ti,Al)N涂层残余应力沿层深呈"钟罩型"分布,且随脉冲偏压的增大应力值明显增加;通过对涂层生长结构及微观成分分析,初步探讨了应力分布机理。随脉冲偏压的增加,涂层硬度会显著增加,而膜/基结合力则先增加后减小;采用改变脉冲偏压的工艺制备(Ti,Al)N涂层,可有效调整涂层残余应力沿层深分布趋势,改善其力学性能。

（Ti,A1）N coatings were prepared on stainless steel substrates by arc ion plating （AIP）. Effects of pulse bias voltage on the depth distribution of residual stresses and mechanical properties of the coatings were investigated. The results indicate that the stress distribution exhibits a ＂bell＂ shape and the stresses increase obviously with pulse bias voltage during depositing coating. According to the growth structures of the coating, the mechanism of stress distribution was analyzed. The hardness of coatings is higher when they deposited under higher bias voltage, but the cohesion of the coating/substrate first decreased then increased with increasing bias voltage. The stress distribution can be modified and the adhesion of the film/ substrate can be obviously improved by changing pulse bias voltage parameter.