FTSC结晶器铜板温度场的数值仿真

Numerical simulation of temperature field in copper plate of FTSC

为了提高薄板坯连铸铸坯质量和延长结晶器铜板的使用寿命,根据结晶器铜板的结构,建立了传热数学模型。计算了结晶器铜板的热流密度,确定出了边界条件,并对结晶器铜板温度场进行数值模拟分析。结果表明:薄板坯连铸结晶器的铜板温度场呈云层状分布。沿高度方向,从结晶器顶部到底部,结晶器铜板热面温度逐渐降低;沿宽度方向,其温度分布也不均匀。Mold-2结晶器铜板热面顶部的局部最高温度326.9℃比Mold-1结晶器的温度222.9℃高很多,这不利于结晶器铜板的使用寿命。

In order to improve the quality of slab of Flexible Thin Slab Continuous Casting（FTSC） and extend the service life of the copper mold, the heat flux density of the copper plate is calculated ac- cording to the structure of the copper mold as a reasonable boundary condition. Then numerical simu- lation of the temperature field in FTSC mold copper plate is accomplished. The results show that the temperature field in the mold copper plate appears a cloudy shape. The temperature distribution in the hot face reduces gradually from top to bottom along with the height direction, and it displays non-uni- form along the width direction. The local maximum temperature on hot surface of the mold copper plate in the Mold-2（326.9 ℃） is much higher than that of the Mold-1（222.9 ℃）, which shorten its service life of the copper mold.