CBZS/AlN玻璃-陶瓷的低温烧结及性能研究

Low Temperature Sintering and Performance of CBZS/AlN Glass-Ceramic

以CaO-B2O3-ZnO-SiO2(CBZS)玻璃粉以及AlN粉体为原料,采用常压烧结法制备了CBZS/AlN玻璃-陶瓷,研究了不同CBZS玻璃含量对复合材料烧结性能、热学性能、介电性能以及力学性能的影响规律。结果表明:CBZS玻璃含量的增加,能有效促进CBZS/AlN玻璃-陶瓷的致密化,可在700～775℃烧结获得致密结构的CBZS/AlN玻璃-陶瓷复合材料;但当CBZS玻璃的含量超过65%后,对玻璃-陶瓷烧结性能的促进作用开始减弱,并恶化了复合材料的热导率与弯曲强度,同时增加其介电损耗。当CBZS玻璃含量为65wt%时,在750℃烧结可获得致密结构的玻璃-陶瓷复合材料,其体积密度为2.87 g.cm-3,热导率为5.31 W/(m.K),介电常数为7.45,介电损耗为0.86×10-3,抗弯强度为209.04MPa。

CBZS/AIN glass-ceramic composites were prepared at low sintering temperature via a conventional sintering method by using CaO-B^O3-ZnO-SiO~ （CBZS） glass and AIN powders as raw materials. The effect of CBZS content change on the sintering, thermal, dielectric and mechanical properties of the composites was investigated. The results showed that CBZS glass could promote the sintering process of CBZS/AIN glass-ceramic, and the sintering temperature was lowered to 700- 775~C. However, when the content of CBZS glass was more than 65 wt%, the effect of CBZS glass on the sintering property of CBZS/AIN glass-ceramic decreased, and the thermal conductivity and bending strength deteriorated, and the dielectric loss increased. With 65 wt% CBZS glass, dense CBZS/AIN glass-ceramic could be sintered at 750~C with the density of 2.87 g.cm^-3 and the thermal conductivity of 5.31 W/（m. K）, the dielectric constant of 7.45, the dielectric loss of 0.86×10^-3 and the bending strength of 209.04 MPa.