机械能助渗硅的研究

Study on Mechanical Energy Aided Siliconizing

开发研究了机械能助渗硅工艺 ,将渗硅温度由常规工艺的 950～ 1 0 50℃降低到 480～ 540℃。用自己研制的渗硅剂 ,在540℃× 4h得到 60 μm的渗硅层。渗硅层表面硬度为 70 0HV0 .1 ,由外向里 ,逐渐降低到其基体硬度。渗硅层表面为Fe3Si相 ,组织致密 ,未发现明显的孔隙 ,能实现无孔渗硅 ,满足耐蚀性要求。渗硅层的硅含量 (质量分数 )为 1 8%左右 ,略高于常规工艺所得渗层的硅含量。机械能助渗硅的渗硅温度低 ,渗硅时间短 ,节能效果十分显著 ,产品质量明显提高 ,且设备投资少 ,原料来源广泛 ,成本低廉 ,将为渗硅在耐蚀性方面的应用提供广阔的前景。

ST5”BZ]The mechanical energy aided siliconizing process is developed.The process temperature is decreased from 950～1050℃ of traditional process to 480～540℃.60μm thickness siliconizing layer is obtained by heating 4h at 540℃ using the agent made by ourselves.The hardness of the siliconizing layer is 700HV 0.1 ,and from outer to inner,the hardness of the layer decrease to the hardness of the matrix gradually.The phase in the surface of the siliconizing layer is Fe 3Si.Obvious holes are not found in the compact siliconizing layer,so free-hole siliconizing can be available.The silicon content in the siliconizing layer is about 18%wt,above that of traditional process.The mechanical energy aided siliconizing process has lower heating temperature,shorter heating time,greater energy-saving effect,higher products quality,less equipment investment,vaster raw materials source and cheaper cost,so this process seems to have a wide application in the corrosion-resistant realm.