摘要
本文通过对军用HIC主要失效模式的分析,指出有源器件失效、引线键合缺陷及沾污是引起军用HIC失效的主要原因,提出提高军用HIC寿命的有效措施。
This paper proposes that the failures of military HIC mainly are caused by the failures of active devices, bonding wires and contaminations through analyzing main failure modes of military HIC, and also provides the useful ways increasing lifetime of military HIC.
出处
《电子元器件应用》
2000年第10期18-20,共3页
Electronic Component & Device Applications
