摘要
本文综述了最近十年来国内外陶瓷 -金属封接及其相关技术的新进展 ,指出了我国该技术领域存在的问题及其解决办法。
In this paper,the recent development progress of ceramic to metal seal and its and related technology both for internal and overseas during for last ten years is overrivewed,The problems and solutions in this field for our country are poinded out.
出处
《真空电子技术》
2000年第5期18-24,共7页
Vacuum Electronics
关键词
陶瓷-金属封接
刀口封接
玻璃
金属化
Ceramic to metal seal
Progress
Iosotatic press,Edge sealing
boundary analysis
