摘要
YAG投影管屏锥封接应力主要是由于玻璃和 YAG单晶的膨胀系统数不匹配造成的。玻璃和 YAG具有不一致的非线性 ,低熔点玻璃等效固化点温度改变将造成封接应力的变化。低熔点玻璃的化学组成 ,熔制条件 ,屏锥封接工艺和其它高温处理工序决定了低熔点玻璃的等效固化点温度。要得到小应力的屏锥封接 ,需控制低熔点玻璃和玻璃的化学组成和熔制参数以及屏锥封接工艺规范。对出现的封接应力在一定程度上可通过改变封接工艺规范和高温处理来消除。
The sealing stress of YAG and glass envelope is the result of the difference between the expansion coefficient of YAG and glass.Different expansion coefficient of YAG and glass and the change of the effective solidification point of low molting glass will affect the stress.In order to realize a stressless sealing the chemical composition of glass and low molting glass as well as sealing process should be tightly controlled.One can also minimize the sealing stress to some extent by changing the wealing process or by firing after sealing.
出处
《真空电子技术》
2000年第5期51-54,共4页
Vacuum Electronics
关键词
YAG投影管
玻璃封接
应力
屏锥封接
YAG projicetion tube,Low molting glass,YAG to glass sealing,Sealing stres|